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Republic Polytechnic
Engineering

E343 Wafer Fabrication and Packaging

This module equips students with the knowledge of the making of semiconductor devices used in consumer electronics.

Students will learn the technologies and processes of Integrated Circuit (IC) fabrication, packaging and appreciate the extensive effort which goes into the making of an IC chip. The module will begin with the processing of the raw material (sand), which will go through the various wafer fabrication, process integration and packaging techniques to form the final product. Various lab sessions are incorporated, equipping students with practical skills of the various wafer fabrication process steps.

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