Engineering
E345 Measurement Techniques and Failure Analysis
This module introduces students to modern measurement and failure analysis techniques commonly applied in the semiconductor industry.
It covers the fundamental principles and methodologies used in device characterisation and defect analysis. Students will learn to evaluate and select appropriate measurement and imaging techniques for specific applications and analysis objectives. Key topics include optical microscopy, electron microscopy, as well as fault localisation techniques. Through hands-on practice, students will gain practical experience in operating analytical instruments such as the Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM).